HOPESEARCH in Expoelectronic Moscow 2024
2024-04-25 16:33:47
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Number of layers：4Layer
Thickness：1.6mm
Copper thickness：1OZ
Surface process：Immersion Au+Carbon
Min aperture：0.3mm
W/S：3.5mil/3.5mil
Number of layers：4Layer
Thickness：1.6mm
Copper thickness：1OZ
Surface process：Immersion Au+Carbon
Min aperture：0.3mm
W/S：3.5mil/3.5mil
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